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Article
- Ghaleeh, M., Baroutaji, A., Al-Esawi, N., Rasool, S. and Chaudhary, T. (2025) Creep properties of environmentally friendly lead-free SAC solder in ball grid array solder connection subjected to cyclic loading. Sustainable & Green Materials.
- Ghaleeh, M., Baroutaji, A. and Qubeissi, M. A. Microstructure, Isothermal and Thermomechanical Fatigue Behaviour of Leaded and Lead-free Solder Joints. Engineering Failure Analysis. 117, p. 104846. 1350-6307.
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