Group by: Item Type | Date
Jump to: 2025
Number of items: 1.
2025
- Ghaleeh, M., Baroutaji, A., Al-Esawi, N., Rasool, S. and Chaudhary, T. (2025) Creep properties of environmentally friendly lead-free SAC solder in ball grid array solder connection subjected to cyclic loading. Sustainable & Green Materials.
Up a level