Ghaleeh, M., Baroutaji, A. and Qubeissi, M. A. Microstructure, Isothermal and Thermomechanical Fatigue Behaviour of Leaded and Lead-free Solder Joints. Engineering Failure Analysis. 117, p. 104846. 1350-6307.
| Item Type: | Article |
|---|---|
| Abstract: | The reliability of solder joints is a critical issue in the microelectronics industry. The requirement of permanent electrical and thermal connections between solder alloys and the various components of a surface mount device is dependent upon the mechanical integrity of the solder and its interfaces. Accordingly, in this paper, the reliability of lead-free, Sn-3.8Ag-0.7Cu, and leaded, Sn-37Pb, solder alloys was investigated under both thermal-mechanical fatigue (TMF) and isothermal mechanical fatigue (IF) conditions. The investigation included material characterisation and fatigue testing on 4-ball grid array (BGA) specimens. The IF tests were carried out under load control at three different temperatures including Room Temperature (RT), 35°C and 75°C. Also, a set of ‘not-in-phase’ (nIP), ‘in-phase’ (IP) and ‘out-of-phase’ (OoP) combined thermal and mechanical cycling tests were carried out to investigate the TMF behaviour of the solders. The stress-life curves for each test condition were generated and then compared taking into account the observations on microstructure. It was found that the IF and TMF performance of Sn-3.8Ag-0.7Cu alloy was better than Sn-37Pb alloy when expressed as stress-life curves. Additionally, the Sn-3.8Ag-0.7Cu was less susceptible to the changes in temperature. This study provides a comprehensive insight into the reliability of solder alloys under a wide range of loading conditions. |
| Uncontrolled Keywords: | solder joints, lead-free, shear stress, ball grid array, thermo-mechanical fatigue, isothermal fatigue |
| Creators: | Ghaleeh, Mohammad, Baroutaji, Ahmad and Qubeissi, Mansour Al |
| Faculties, Divisions and Institutes: | Faculties > Faculty of Arts, Science & Technology > Engineering |
| Page Range: | p. 104846 |
| Journal or Publication Title: | Engineering Failure Analysis |
| Volume: | 117 |
| Number of Pages: | 39 |
| Language: | English |
| DOI: | https://doi.org/10.1016/j.engfailanal.2020.104846 |
| ISSN: | 1350-6307 |
| Status: | Published / Disseminated |
| Refereed: | Yes |
| Related URLs: | |
| URI: | http://nectar.northampton.ac.uk/id/eprint/13244 |
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